Description
IS200TBAIH1C Product Introduction
The specific application scope of the product
will depend on the needs of system integration and industrial application, but generally speaking, this type of embedded controller module can be applied to the following categories:
manufacturing processes, etc.
monitoring and control system.
of the controller module, as well as the specific needs of the customer.
designed to manage gas or steam turbines.
It has a CIMPLICITY graphical interface and an HMI with software suitable for running heavy-duty turbines.
be installed at the bottom of the cabinet. For a small setup that is easy to serve a triple redundant system, up to three components can be installed side by side.
he board can operate within a temperature range of 0 to 65 degrees Celsius without the need for a fan for cooling. NFPA Class 1. This board can be used for two applications.
Activities in the automotive electronics sector will include: SAE-AWC 2021 Automotive Electronics Innovation Technology Forum, “Smart Car “Hundred Forum” Issue 21 – China Automotive Semiconductor Technology Summit Forum”, AWC 2021 Third Automotive Digital Cockpit Forum wait. At the same time, the China Intelligent Connected Vehicle Industry Summit will invite speakers from well-known industry companies, research institutions, universities and other industries with advanced technological advantages in the field of intelligent connected vehicles and new energy vehicles to share their experience in the design, development and production of intelligent connected vehicles. Problem solving and innovative technology; in future smart transportation, the relationship between cars, software, data, environment, and ecology, and how car companies and suppliers can better work together to create future value.The activities in the intelligent manufacturing and terminal application section are more abundant, including: Global Intelligent Manufacturing Academy, NEPCON World Hardware Electronics Innovation Conference, ” NEPCON and Smart Factory 1.0 – The Future of Electronic Manufacturing” themed seminar, Internet of Things Innovation Technology and Application Conference, SiP Micro-assembly industry breakthrough and innovation summit forum and 5G mobile phone intelligent manufacturing industry chain summit, etc.Activities in the electronic components and materials section will include, 2021 Domestic Semiconductor Industry High-end Summit, Innovation and Opportunities, Empowering Domestic Brands – 2021 Bay Area China Piezoelectric Crystal Information Technology Forum, “Focus on Internet of Things Technology, Insights into Cutting-edge Applications” Summit Forum, seminar on the road ahead under core shortage, component trading forum, etc.
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