Description
IS200RAPAG1BAA Product Introduction
The specific application scope of the product
will depend on the needs of system integration and industrial application, but generally speaking, this type of embedded controller module can be applied to the following categories:
manufacturing processes, etc.
monitoring and control system.
of the controller module, as well as the specific needs of the customer.
designed to manage gas or steam turbines.
It has a CIMPLICITY graphical interface and an HMI with software suitable for running heavy-duty turbines.
be installed at the bottom of the cabinet. For a small setup that is easy to serve a triple redundant system, up to three components can be installed side by side.
he board can operate within a temperature range of 0 to 65 degrees Celsius without the need for a fan for cooling. NFPA Class 1. This board can be used for two applications.
7. Coating/Developing Equipment: DNS, EV Group, Suss MicroTec, TEL, Shenyang Xinyuan Ningbo Runhua Quanxin8. Etching/Removal Glue/ashing equipment: Applied Materials, Aviza Technology, Axic, Hitachi High Technologies Ningbo Runhua Full Core Hefei Zhenping Technology 9. CMP equipment: Applied Materials,Ebara Corporation, Entrepix, Kinetic Systems, Novellus10. Electroplating system equipment: Applied Materials, ECI Technology, Novellus, Semitool, Surfect11. Graphite components/materials for semiconductor processes: POCO Graphite, Carbone Lorraine, TOYO TANSO12. Packaging and testing equipment: Hangzhou Changchuan, Peride Technology, Shenzhen Nuotai, Shenzhen Fude , Taicang Chenqi, etc.;13. Water treatment equipment: Shenzhen Pure Water No. 1, Shenzhen Water Vision, Changzhou Veolia, etc.Mainland China: Northern Huachuang Microelectronics Equipment, China Microelectronics Equipment, Shanghai Microelectronics Equipment, Tuojing Technology, China Electronics Equipment Group, China Microelectronics, Seven Star Huachuang, Huahai Qingke, Shennan Circuits, Ruili Science Instruments, Shanghai Microelectronics, Dayiheng Precision Machinery, Hanmin Technology, Qisheng Machinery Equipment, Shanghai Kangkesi Trading, etc.4. Wafer foundries1. International: GlobalFoundries, Samsung (China) Semiconductor Co., Ltd., Tower Jazz, Dongbu, Magna, IBM, Fujitsu, Intel, SK Hynix Semiconductor (China) Co., Ltd. 2.China Mainland China and Taiwan: TSMC, UMC, Hejian Technology, Powerchip, SMIC, Huahong Hongli, Demao, Wuhan Xinxin, Huawei Microelectronics, Huali Microelectronics, Powerchip, Intel Semiconductor (Dalian) Co., Ltd. , Xi”an Microelectronics, Jilin Hua Microelectronics5. Packaging and testing companies1. International: Amkor, STATS ChipPAC, J-devices, Unisem, Nepes2. Mainland China and Taiwan: ASE, Licheng, Nanmao, Qi Bang, KYEC Electronics, Fumao, Lingsheng Precision, Silicon Products, Changdian, Ute, Advanced Semiconductor, Tongfu Microelectronics, Tianshui Huatian, Nantong Huada Microelectronics, Verizon United Semiconductor, Intel Products (Chengdu) Co., Ltd., Haitai Semiconductor (Wuxi) Co., Ltd., Jiangsu Xinchao Technology, Amkor Packaging and Testing (Shanghai) Co., Ltd., Sandis Semiconductor (Shanghai) Co., Ltd., Lichengliu, IDM 1, International: Intel, Samsung,PhaseOne Carl, Hynix, NEC, NXP, Renesas, STMicroelectronics, TI, Toshiba2. Mainland: Shanghai Belling, China Resources Microelectronics, Silan Microelectronics7. Electronic component distributors1. International: Avnet, Arrow, Future Electronics, WPG, TTI, Macnica, Digi-Key Corporation, Newark Element14, Mouser Electronics, Fusion Worldwide2. China: Comtech, China Electronics, Lubicom, Tycoyuan, Weishixin, Patai, Xinheda, Xinzhi, Beijing Gaozhi, Asiacom8, electronic manufacturing service providers (EMS) 1.International: Flextronics, Jabil, Celestica, New Meiya, Baidian, Plexus, Venture Manufacturing, Cooltech, Hicks, Zhuoneng 2, China: Hon Hai,New Jinbao, Great Wall Development, USI, Huatai, Asustek, Quanta, Inventec, TPV, Wistron9. Terminal brands1. International: Apple, Samsung, IBM, Sony, Toshiba, Dell, Fujitsu, NEC, Panasonic, HP2. China: Huawei, ZTE, lenovo , Xiaomi, OPPO, ASUS, Acer, Shenzhou, Meizu, Coolpad10, EDA design software manufacturers1. International: Synopsys, Mentor, Cadence2. China: Huada Jiutian, Xinhe Technology, Guangli Micro, Boda Micro, Chip Vision, Xcelis, Shengjing Micro, Jiyesi, Xunmei, etc.
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