Description
5463-783 From Woodward, USA
Non differential regulation is mainly used for constant speed control and is suitable for single machine operation or multiple prime movers working together in an isolated power grid. Differential regulation provides more control flexibility.
further enhancing its performance and application range.
rich additional functions, and high-precision output signals. Whether it is in the fields of generator sets, compressors, pump stations, or ships and locomotives, it can effectively ensure the stable operation of equipment within the set range.
power measurement level 1, editable screen, multi interface toolkit connection, etc. All details can be found in Woodward easyYgen manual 37582A
The rated operating temperature range of this model is -20 to 70 ° C; the rated temperature range of the LT model is -40 to 70 ° C, suitable for outdoor use.
5463-783 is equipped with a monitor (not available on the 3100 model) and is designed for front panel installation.
The built-in HMI has a color LCD and soft keys (now with dedicated buttons) for direct control of the 5463-783 device. Multi level password protection can prevent unauthorized changes.
The generator set has four operating modes and the option to configure a manual circuit breaker control device.
How to use 5463-783？
What is 5463-783 used for?
5463-783 Customs Code
(3)Market size:(4) Related companies: APC, Emerson Network Power, Kehua Hengsheng(5) Recommendation index: Recommended4. Switching power supply5. Power factor correction technology6. Application of power electronics technology in power systems7. LED driver power supply8. Other applications[Introduction] 1. IC design companies 1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera2, Taiwan: mainly MediaTek, Duntai Technology, Elan Electronics, Egis Technology, Sungyang, VIA et al. 3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor, Quanzhi Technology, Huada Semiconductor, Datang Semiconductor, Zhixin Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying Electronics, Montage Technology, BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan Microelectronics, Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc. 2. Semiconductor materials companies 1. International: JSRMcroelectronics, ETSC Technologies Co. , SEMI…1. IC design companies1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera2. Taiwan: Mainly MediaTek, Duntai Technology, Elan Electronics, Egis Technology, Sungyang, VIA, etc. .3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor , Quanzhi Technology, Huada Semiconductor, Datang Semiconductor, Zhixin Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying Electronics, Montage Technology, BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan Microelectronics, Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc.2. Semiconductor materials companies1. International: JSR Microelectronics, ETSC Technologies Co. , SEMI, Air Products, Ablestik, Cadence, Abrasive Technology, Praxair Electronics, TBW Industries, Applied Materials2. Mainland China: Tepuco Industrial, Zhejiang Jinruihong, Nanjing Guosheng, Hebei Puxing, Youyan, Shandong University of Science and Technology Dingxin, Beijing Da Bo, Ningbo Jiangfeng, Youyan Yijin, Shanghai Xinyang, Anji, Zhongneng Silicon Technology, Zhonghuan Semiconductor, Jinglong Group, Xinte Energy, Xi”an LONGi, China Silicon Hi-Tech, Sunshine Energy, Oridian Optoelectronics, Tianhong Silicon, Shanghai Shenhe Thermal Magnetic (wholly owned by a Japanese company), Guosheng Electronics, Jiangfeng Electronic Materials, Youyan Yijin, Beijing Dabo, Shanghai Xinyang, Anji Microelectronics, Youyan New Materials, Hubei Xingfu Electronics, Jianghua Micro, Jin Ruihong, etc.3. Semiconductor equipment manufacturing companies1. Wafer cleaning equipment: Applied Materials, Dainippon Screen (DNS) Changzhou Silicon Micro, Kunshan Zhicheng, Beijing Hualin Jiaye, Suzhou Shimike, Ningbo Runhua Quanxin, Tianjin Nanxuan, Shandong Jie Sheng et al.2. Heat treatment equipment: Applied Materials, ASM3. Ion implantation equipment: Applied Materials4. CVD/PECVD/ALD equipment:5. PVD equipment: Applied Materials, Aviza Technology, KDF, Novellus, Oerlikon, Northern Microelectronics6. Photolithography Equipment: ASML, Canon, EV Group, Molecular Imprints, Nikon Precision, Beijing Jingzhen7. Coating/Developing Equipment: DNS, EV Group, Suss Mi
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