Description
- BENTLY 3500/32 125712-01 gateway is designed with multi protocol compatibility and modularity, seamlessly connecting industrial systems,
- operating at a wide temperature range of -40 ° C to 85 ° C, supporting 8-channel rotating equipment monitoring,
- remote configuration to improve efficiency, and ensuring stable power and automation.
It can connect the Bently Nevada 3500 system with other control systems or host computers to achieve data interconnectivity.
thus achieving integration with other industrial control systems.
7. Coating/Developing Equipment: DNS, EV Group, Suss MicroTec, TEL, Shenyang Xinyuan Ningbo Runhua Quanxin8. Etching/Removal Glue/ashing equipment: Applied Materials, Aviza Technology, Axic, Hitachi High Technologies Ningbo Runhua Full Core Hefei Zhenping Technology 9. CMP equipment: Applied Materials,Ebara Corporation, Entrepix, Kinetic Systems, Novellus10. Electroplating system equipment: Applied Materials, ECI Technology, Novellus, Semitool, Surfect11. Graphite components/materials for semiconductor processes: POCO Graphite, Carbone Lorraine, TOYO TANSO12. Packaging and testing equipment: Hangzhou Changchuan, Peride Technology, Shenzhen Nuotai, Shenzhen Fude , Taicang Chenqi, etc.;13. Water treatment equipment: Shenzhen Pure Water No. 1, Shenzhen Water Vision, Changzhou Veolia, etc.Mainland China: Northern Huachuang Microelectronics Equipment, China Microelectronics Equipment, Shanghai Microelectronics Equipment, Tuojing Technology, China Electronics Equipment Group, China Microelectronics, Seven Star Huachuang, Huahai Qingke, Shennan Circuits, Ruili Science Instruments, Shanghai Microelectronics, Dayiheng Precision Machinery, Hanmin Technology, Qisheng Machinery Equipment, Shanghai Kangkesi Trading, etc.4. Wafer foundries1. International: GlobalFoundries, Samsung (China) Semiconductor Co., Ltd., Tower Jazz, Dongbu, Magna, IBM, Fujitsu, Intel, SK Hynix Semiconductor (China) Co., Ltd. 2.China Mainland China and Taiwan: TSMC, UMC, Hejian Technology, Powerchip, SMIC, Huahong Hongli, Demao, Wuhan Xinxin, Huawei Microelectronics, Huali Microelectronics, Powerchip, Intel Semiconductor (Dalian) Co., Ltd. , Xi”an Microelectronics, Jilin Hua Microelectronics5. Packaging and testing companies1. International: Amkor, STATS ChipPAC, J-devices, Unisem, Nepes2. Mainland China and Taiwan: ASE, Licheng, Nanmao, Qi Bang, KYEC Electronics, Fumao, Lingsheng Precision, Silicon Products, Changdian, Ute, Advanced Semiconductor, Tongfu Microelectronics, Tianshui Huatian, Nantong Huada Microelectronics, Verizon United Semiconductor, Intel Products (Chengdu) Co., Ltd., Haitai Semiconductor (Wuxi) Co., Ltd., Jiangsu Xinchao Technology, Amkor Packaging and Testing (Shanghai) Co., Ltd., Sandis Semiconductor (Shanghai) Co., Ltd., Lichengliu, IDM 1, International: Intel, Samsung,PhaseOne Carl, Hynix, NEC, NXP, Renesas, STMicroelectronics, TI, Toshiba2. Mainland: Shanghai Belling, China Resources Microelectronics, Silan Microelectronics7. Electronic component distributors1. International: Avnet, Arrow, Future Electronics, WPG, TTI, Macnica, Digi-Key Corporation, Newark Element14, Mouser Electronics, Fusion Worldwide2. China: Comtech, China Electronics, Lubicom, Tycoyuan, Weishixin, Patai, Xinheda, Xinzhi, Beijing Gaozhi, Asiacom8, electronic manufacturing service providers (EMS) 1.International: Flextronics, Jabil, Celestica, New Meiya, Baidian, Plexus, Venture Manufacturing, Cooltech, Hicks, Zhuoneng 2, China: Hon Hai,New Jinbao, Great Wall Development, USI, Huatai, Asustek, Quanta, Inventec, TPV, Wistron9. Terminal brands1. International: Apple, Samsung, IBM, Sony, Toshiba, Dell, Fujitsu, NEC, Panasonic, HP2. China: Huawei, ZTE, lenovo , Xiaomi, OPPO, ASUS, Acer, Shenzhou, Meizu, Coolpad10, EDA design software manufacturers1. International: Synopsys, Mentor, Cadence2. China: Huada Jiutian, Xinhe Technology, Guangli Micro, Boda Micro, Chip Vision, Xcelis, Shengjing Micro, Jiyesi, Xunmei, etc.
BENTLY 330100-90-01
BENTLY 330103-00-03-05-02-05
BENTLY 330103-00-04-10-02-00
BENTLY 330104-00-05-10-02-00
BENTLY 330104-00-05-10-02-CN
BENTLY 330105-02-12-05-02-05
BENTLY 330106-05-30-10-02-00
BENTLY 330108-91-05
BENTLY 330130-040-00-00
BENTLY 330130-040-01-00
BENTLY 330130-045-00-00
BENTLY 330130-080-00-00 Standard Extension Cable
BENTLY 330130-085-00-00
BENTLY 330180-90-05
BENTLY 330180-X1-CN
BENTLY 330703-000-070-10-02-05
BENTLY 330854-040-24-00
BENTLY 330901-05-32-05-02-00
BENTLY 330980-51-00
BENTLY 3500
BENTLY 3500/05-02-04-00-00-01
BENTLY 3500/05-01-02-00-00-01
BENTLY 3500/05-01-03-00-00-00
BENTLY 3500/15 133292-01
BENTLY 3500/20 125744-02
BENTLY 3500/22-01-01-00
BENTLY 3500/22M 288055-01
BENTLY 3500/22M 138607-01
BENTLY 3500/22M 288055-01
BENTLY 3500/25 125792-01
BENTLY 3500/25 149369-01
BENTLY 3500/32 125712-01
BENTLY 3500/32M 149986-02
BENTLY 3500/33
BENTLY 3500/33-01-00
BENTLY 3500/40M 176449-01
BENTLY 3500/40M(140734-01)
BENTLY 3500/42M 140734-02
BENTLY 3500/42M 176449-02
BENTLY 3500/45 176449-04
BENTLY 3500/45-01-00
BENTLY 3500/53 133388-01
BENTLY 3500/60 163179-01
BENTLY 3500/61 163179-02
BENTLY 3500/62
BENTLY 3500/70M 176449-08
BENTLY 3500/72M
BENTLY Communication gateway module 3500/91-01-01(161204-01+161216-01)
BENTLY 3500/92 136180-01
BENTLY 60M100-00
BENTLY 84152-01
BENTLY 9200-01-01-10-00
BENTLY ASSY78462-01U 78599-01A
1701/10-01 Temperature monitor BENTLY
3500/50 288062-02 BENTLY overspeed protection module