3500/15 125840-01 BENTLY TSI system module

3500/15 125840-01 BENTLY TSI system module

Product model: BENTLY 3500/15 125840-01
Working voltage: 24VDC

Working temperature: -40 ℃~85 ℃

Working humidity: 0~95%

Interface type: RS-485
BENTLY 3500/15 125840-01 is a mechanical vibration monitoring system used to monitor the vibration level of rotating machinery. It can detect bearing vibration, mechanical imbalance, and other mechanical problems to ensure the normal operation of mechanical equipment

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  • Email:sauldcsplc@outlook.com
  • Phone:+86 18350224834
  • WhatsApp:+8618350224834

Description

3500/15 125840-01 BENTLY TSI system module

3500/15 125840-01 Product Introduction
  • BENTLY 3500/15 125840-01 gateway is designed with multi protocol compatibility and modularity, seamlessly connecting industrial systems, 
  • operating at a wide temperature range of -40 ° C to 85 ° C, supporting 8-channel rotating equipment monitoring, 
  • remote configuration to improve efficiency, and ensuring stable power and automation.
1、 Product Overview
BENTLY 3500/15 125840-01 is part of the Bently Nevada 3500 series monitoring system and is a communication gateway module designed specifically for industrial automation and process control applications.
It can connect the Bently Nevada 3500 system with other control systems or host computers to achieve data interconnectivity.
2、 Main characteristics
Communication interface: This module has rich communication interfaces and supports multiple communication protocols such as Ethernet, RS232, RS485, etc. It can be compatible with protocols such as Modbus and TCP/IP,
thus achieving integration with other industrial control systems.
input/output signal
Input signal: 0-10V DC, 4-20mA DC.
Output signal: 0-10V DC, 4-20mA DC.
Channel Count: Provides 8 analog input and 8 analog output channels to meet various monitoring and control requirements.
Working parameters:
Working voltage: 24VDC.
Working temperature range: -40 ° C to+85 ° C (some sources mention -30 ° C to+65 ° C or -40 ° C to+70 ° C, depending on the application environment).
Working humidity: 0% to 95%.
Remote configuration and management: Supports remote configuration and management functions, allowing for remote system settings and monitoring through the network, improving operational efficiency.
Modular design: Adopting a modular design, it is easy to install and maintain, reducing system downtime and maintenance costs.
High reliability and stability: After rigorous testing and validation, it ensures stable performance in various harsh environments, suitable for multiple fields such as industrial automation, process control, mechanical vibration monitoring and protection.
Contact Us
 
Mobile phone: 18350224834
 
E-mail： sauldcsplc@outlook.com
 
WhatsApp：+86 18350224834

(3)Market size:(4) Related companies: APC, Emerson Network Power, Kehua Hengsheng(5) Recommendation index: Recommended4. Switching power supply5. Power factor correction technology6. Application of power electronics technology in power systems7. LED driver power supply8. Other applications[Introduction] 1. IC design companies 1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera2, Taiwan: mainly MediaTek, Duntai Technology, Elan Electronics, Egis Technology, Sungyang, VIA et al. 3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor, Quanzhi Technology, Huada Semiconductor, Datang Semiconductor, Zhixin Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying Electronics, Montage Technology, BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan Microelectronics, Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc. 2. Semiconductor materials companies 1. International: JSRMcroelectronics, ETSC Technologies Co. , SEMI…1. IC design companies1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera2. Taiwan: Mainly MediaTek, Duntai Technology, Elan Electronics, Egis Technology, Sungyang, VIA, etc. .3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor , Quanzhi Technology, Huada Semiconductor, Datang Semiconductor, Zhixin Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying Electronics, Montage Technology, BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan Microelectronics, Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc.2. Semiconductor materials companies1. International: JSR Microelectronics, ETSC Technologies Co. , SEMI, Air Products, Ablestik, Cadence, Abrasive Technology, Praxair Electronics, TBW Industries, Applied Materials2. Mainland China: Tepuco Industrial, Zhejiang Jinruihong, Nanjing Guosheng, Hebei Puxing, Youyan, Shandong University of Science and Technology Dingxin, Beijing Da Bo, Ningbo Jiangfeng, Youyan Yijin, Shanghai Xinyang, Anji, Zhongneng Silicon Technology, Zhonghuan Semiconductor, Jinglong Group, Xinte Energy, Xi”an LONGi, China Silicon Hi-Tech, Sunshine Energy, Oridian Optoelectronics, Tianhong Silicon, Shanghai Shenhe Thermal Magnetic (wholly owned by a Japanese company), Guosheng Electronics, Jiangfeng Electronic Materials, Youyan Yijin, Beijing Dabo, Shanghai Xinyang, Anji Microelectronics, Youyan New Materials, Hubei Xingfu Electronics, Jianghua Micro, Jin Ruihong, etc.3. Semiconductor equipment manufacturing companies1. Wafer cleaning equipment: Applied Materials, Dainippon Screen (DNS) Changzhou Silicon Micro, Kunshan Zhicheng, Beijing Hualin Jiaye, Suzhou Shimike, Ningbo Runhua Quanxin, Tianjin Nanxuan, Shandong Jie Sheng et al.2. Heat treatment equipment: Applied Materials, ASM3. Ion implantation equipment: Applied Materials4. CVD/PECVD/ALD equipment:5. PVD equipment: Applied Materials, Aviza Technology, KDF, Novellus, Oerlikon, Northern Microelectronics6. Photolithography Equipment: ASML, Canon, EV Group, Molecular Imprints, Nikon Precision, Beijing Jingzhen7. Coating/Developing Equipment: DNS, EV Group, Suss Mi

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