Description
- 32-bit DSP digital control mode
- Low vibration, low noise, low power consumption
- Maximum output current 3A/phase
- Adopting CAN bus and supporting standard CANopen communication protocol, it can load up to 127 devices
- Supports three modes: protocol position control, speed control, and periodic position control
- Current setting, subdivision, motor start stop control, and real-time monitoring of motor operation can be achieved through the bus
- 2-channel optoelectronic isolation programmable input interface
medical equipment, various types of robots, robotic arms, automated production lines, and various CNC machine tools.
7. Coating/Developing Equipment: DNS, EV Group, Suss MicroTec, TEL, Shenyang Xinyuan Ningbo Runhua Quanxin8. Etching/Removal Glue/ashing equipment: Applied Materials, Aviza Technology, Axic, Hitachi High Technologies Ningbo Runhua Full Core Hefei Zhenping Technology 9. CMP equipment: Applied Materials,Ebara Corporation, Entrepix, Kinetic Systems, Novellus10. Electroplating system equipment: Applied Materials, ECI Technology, Novellus, Semitool, Surfect11. Graphite components/materials for semiconductor processes: POCO Graphite, Carbone Lorraine, TOYO TANSO12. Packaging and testing equipment: Hangzhou Changchuan, Peride Technology, Shenzhen Nuotai, Shenzhen Fude , Taicang Chenqi, etc.;13. Water treatment equipment: Shenzhen Pure Water No. 1, Shenzhen Water Vision, Changzhou Veolia, etc.Mainland China: Northern Huachuang Microelectronics Equipment, China Microelectronics Equipment, Shanghai Microelectronics Equipment, Tuojing Technology, China Electronics Equipment Group, China Microelectronics, Seven Star Huachuang, Huahai Qingke, Shennan Circuits, Ruili Science Instruments, Shanghai Microelectronics, Dayiheng Precision Machinery, Hanmin Technology, Qisheng Machinery Equipment, Shanghai Kangkesi Trading, etc.4. Wafer foundries1. International: GlobalFoundries, Samsung (China) Semiconductor Co., Ltd., Tower Jazz, Dongbu, Magna, IBM, Fujitsu, Intel, SK Hynix Semiconductor (China) Co., Ltd. 2.China Mainland China and Taiwan: TSMC, UMC, Hejian Technology, Powerchip, SMIC, Huahong Hongli, Demao, Wuhan Xinxin, Huawei Microelectronics, Huali Microelectronics, Powerchip, Intel Semiconductor (Dalian) Co., Ltd. , Xi”an Microelectronics, Jilin Hua Microelectronics5. Packaging and testing companies1. International: Amkor, STATS ChipPAC, J-devices, Unisem, Nepes2. Mainland China and Taiwan: ASE, Licheng, Nanmao, Qi Bang, KYEC Electronics, Fumao, Lingsheng Precision, Silicon Products, Changdian, Ute, Advanced Semiconductor, Tongfu Microelectronics, Tianshui Huatian, Nantong Huada Microelectronics, Verizon United Semiconductor, Intel Products (Chengdu) Co., Ltd., Haitai Semiconductor (Wuxi) Co., Ltd., Jiangsu Xinchao Technology, Amkor Packaging and Testing (Shanghai) Co., Ltd., Sandis Semiconductor (Shanghai) Co., Ltd., Lichengliu, IDM 1, International: Intel, Samsung,PhaseOne Carl, Hynix, NEC, NXP, Renesas, STMicroelectronics, TI, Toshiba2. Mainland: Shanghai Belling, China Resources Microelectronics, Silan Microelectronics7. Electronic component distributors1. International: Avnet, Arrow, Future Electronics, WPG, TTI, Macnica, Digi-Key Corporation, Newark Element14, Mouser Electronics, Fusion Worldwide2. China: Comtech, China Electronics, Lubicom, Tycoyuan, Weishixin, Patai, Xinheda, Xinzhi, Beijing Gaozhi, Asiacom8, electronic manufacturing service providers (EMS) 1.International: Flextronics, Jabil, Celestica, New Meiya, Baidian, Plexus, Venture Manufacturing, Cooltech, Hicks, Zhuoneng 2, China: Hon Hai,New Jinbao, Great Wall Development, USI, Huatai, Asustek, Quanta, Inventec, TPV, Wistron9. Terminal brands1. International: Apple, Samsung, IBM, Sony, Toshiba, Dell, Fujitsu, NEC, Panasonic, HP2. China: Huawei, ZTE, lenovo , Xiaomi, OPPO, ASUS, Acer, Shenzhou, Meizu, Coolpad10, EDA design software manufacturers1. International: Synopsys, Mentor, Cadence2. China: Huada Jiutian, Xinhe Technology, Guangli Micro, Boda Micro, Chip Vision, Xcelis, Shengjing Micro, Jiyesi, Xunmei, etc.
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