Description
DS200DTBBG1ABB Product Introduction
The specific application scope of the product
will depend on the needs of system integration and industrial application, but generally speaking, this type of embedded controller module can be applied to the following categories:
manufacturing processes, etc.
monitoring and control system.
of the controller module, as well as the specific needs of the customer.
designed to manage gas or steam turbines.
It has a CIMPLICITY graphical interface and an HMI with software suitable for running heavy-duty turbines.
be installed at the bottom of the cabinet. For a small setup that is easy to serve a triple redundant system, up to three components can be installed side by side.
he board can operate within a temperature range of 0 to 65 degrees Celsius without the need for a fan for cooling. NFPA Class 1. This board can be used for two applications.
(3)Market size:(4) Related companies: APC, Emerson Network Power, Kehua Hengsheng(5) Recommendation index: Recommended4. Switching power supply5. Power factor correction technology6. Application of power electronics technology in power systems7. LED driver power supply8. Other applications[Introduction] 1. IC design companies 1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera2, Taiwan: mainly MediaTek, Duntai Technology, Elan Electronics, Egis Technology, Sungyang, VIA et al. 3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor, Quanzhi Technology, Huada Semiconductor, Datang Semiconductor, Zhixin Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying Electronics, Montage Technology, BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan Microelectronics, Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc. 2. Semiconductor materials companies 1. International: JSRMcroelectronics, ETSC Technologies Co. , SEMI…1. IC design companies1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera2. Taiwan: Mainly MediaTek, Duntai Technology, Elan Electronics, Egis Technology, Sungyang, VIA, etc. .3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor , Quanzhi Technology, Huada Semiconductor, Datang Semiconductor, Zhixin Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying Electronics, Montage Technology, BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan Microelectronics, Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc.2. Semiconductor materials companies1. International: JSR Microelectronics, ETSC Technologies Co. , SEMI, Air Products, Ablestik, Cadence, Abrasive Technology, Praxair Electronics, TBW Industries, Applied Materials2. Mainland China: Tepuco Industrial, Zhejiang Jinruihong, Nanjing Guosheng, Hebei Puxing, Youyan, Shandong University of Science and Technology Dingxin, Beijing Da Bo, Ningbo Jiangfeng, Youyan Yijin, Shanghai Xinyang, Anji, Zhongneng Silicon Technology, Zhonghuan Semiconductor, Jinglong Group, Xinte Energy, Xi”an LONGi, China Silicon Hi-Tech, Sunshine Energy, Oridian Optoelectronics, Tianhong Silicon, Shanghai Shenhe Thermal Magnetic (wholly owned by a Japanese company), Guosheng Electronics, Jiangfeng Electronic Materials, Youyan Yijin, Beijing Dabo, Shanghai Xinyang, Anji Microelectronics, Youyan New Materials, Hubei Xingfu Electronics, Jianghua Micro, Jin Ruihong, etc.3. Semiconductor equipment manufacturing companies1. Wafer cleaning equipment: Applied Materials, Dainippon Screen (DNS) Changzhou Silicon Micro, Kunshan Zhicheng, Beijing Hualin Jiaye, Suzhou Shimike, Ningbo Runhua Quanxin, Tianjin Nanxuan, Shandong Jie Sheng et al.2. Heat treatment equipment: Applied Materials, ASM3. Ion implantation equipment: Applied Materials4. CVD/PECVD/ALD equipment:5. PVD equipment: Applied Materials, Aviza Technology, KDF, Novellus, Oerlikon, Northern Microelectronics6. Photolithography Equipment: ASML, Canon, EV Group, Molecular Imprints, Nikon Precision, Beijing Jingzhen7. Coating/Developing Equipment: DNS, EV Group, Suss Mi
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