Description
- BENTLY 200200-05-05-05 gateway is designed with multi protocol compatibility and modularity, seamlessly connecting industrial systems,
- operating at a wide temperature range of -40 ° C to 85 ° C, supporting 8-channel rotating equipment monitoring,
- remote configuration to improve efficiency, and ensuring stable power and automation.
It can connect the Bently Nevada 3500 system with other control systems or host computers to achieve data interconnectivity.
thus achieving integration with other industrial control systems.
(3)Market size:(4) Related companies: APC, Emerson Network Power, Kehua Hengsheng(5) Recommendation index: Recommended4. Switching power supply5. Power factor correction technology6. Application of power electronics technology in power systems7. LED driver power supply8. Other applications[Introduction] 1. IC design companies 1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera2, Taiwan: mainly MediaTek, Duntai Technology, Elan Electronics, Egis Technology, Sungyang, VIA et al. 3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor, Quanzhi Technology, Huada Semiconductor, Datang Semiconductor, Zhixin Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying Electronics, Montage Technology, BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan Microelectronics, Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc. 2. Semiconductor materials companies 1. International: JSRMcroelectronics, ETSC Technologies Co. , SEMI…1. IC design companies1. International: Qualcomm, Broadcom, MediaTek, Nvidia, Marvell, Xilinx, Altera2. Taiwan: Mainly MediaTek, Duntai Technology, Elan Electronics, Egis Technology, Sungyang, VIA, etc. .3. Mainland China: Unisoc, ZTE Microelectronics, Duntai, HiSilicon Semiconductor , Quanzhi Technology, Huada Semiconductor, Datang Semiconductor, Zhixin Microelectronics, National Microelectronics, Vimicro Microelectronics, Unisoc Guoxin, National Technology , Orbit, Zhongying Electronics, Montage Technology, BeidouStar, Beijing Junzheng, GigaDevice, Geke Microelectronics, China Electronics, Weill Semiconductor, Tongchuang National Chip, Fudan Microelectronics, Apex Microelectronics, Hui Top Technology, MediaTek, Chipone North, Tongfang Microelectronics, Zhongtian Lianke, Shengbang Microelectronics, etc.2. Semiconductor materials companies1. International: JSR Microelectronics, ETSC Technologies Co. , SEMI, Air Products, Ablestik, Cadence, Abrasive Technology, Praxair Electronics, TBW Industries, Applied Materials2. Mainland China: Tepuco Industrial, Zhejiang Jinruihong, Nanjing Guosheng, Hebei Puxing, Youyan, Shandong University of Science and Technology Dingxin, Beijing Da Bo, Ningbo Jiangfeng, Youyan Yijin, Shanghai Xinyang, Anji, Zhongneng Silicon Technology, Zhonghuan Semiconductor, Jinglong Group, Xinte Energy, Xi”an LONGi, China Silicon Hi-Tech, Sunshine Energy, Oridian Optoelectronics, Tianhong Silicon, Shanghai Shenhe Thermal Magnetic (wholly owned by a Japanese company), Guosheng Electronics, Jiangfeng Electronic Materials, Youyan Yijin, Beijing Dabo, Shanghai Xinyang, Anji Microelectronics, Youyan New Materials, Hubei Xingfu Electronics, Jianghua Micro, Jin Ruihong, etc.3. Semiconductor equipment manufacturing companies1. Wafer cleaning equipment: Applied Materials, Dainippon Screen (DNS) Changzhou Silicon Micro, Kunshan Zhicheng, Beijing Hualin Jiaye, Suzhou Shimike, Ningbo Runhua Quanxin, Tianjin Nanxuan, Shandong Jie Sheng et al.2. Heat treatment equipment: Applied Materials, ASM3. Ion implantation equipment: Applied Materials4. CVD/PECVD/ALD equipment:5. PVD equipment: Applied Materials, Aviza Technology, KDF, Novellus, Oerlikon, Northern Microelectronics6. Photolithography Equipment: ASML, Canon, EV Group, Molecular Imprints, Nikon Precision, Beijing Jingzhen7. Coating/Developing Equipment: DNS, EV Group, Suss Mi
129478-01 Belonging to the Bently Nevada 3500 series
3500/45 140072-04 3500 series front card and rear card
3500/72M 140734-08 3500 series front card and rear card
3300/50-02-01-00-00 Bently State Monitoring Interface System
125760-01 BENTLY TSI system module
330195-02-12-10-00 Bently State Monitoring Interface System
125800-01 Mechanical vibration monitoring system
163179-01 BENTLY TSI system module
330850-50-00 BENTLY series: 3500 communication gateway module
125800-01 Bently State Monitoring Interface System
3500/62 Belonging to the Bently Nevada 3500 series
3500/42M 135489-01 Belonging to the Bently Nevada 3500 series
167699-02 Mechanical vibration monitoring system
3500/60 Belonging to the Bently Nevada 3500 series
176449-02 Bently State Monitoring Interface System
3500/53 133396-01 3500 series front card and rear card
3500/77M Belonging to the Bently Nevada 3500 series
9200-01-01-10-00 BENTLY TSI system module
3500/05-01-03-01-00-00 BENTLY TSI system module
176449-02V BENTLY TSI system module
135137-01 BENTLY series: 3500 communication gateway module
3300/14 3500 series front card and rear card
3500/05-02-02 Belonging to the Bently Nevada 3500 series
9200-01-01-10-00 BENTLY series: 3500 communication gateway module
35000/22M (138607-01) 3500 series front card and rear card
3500/32 125712-01 3500 series front card and rear card
106M1079-01 Bently State Monitoring Interface System
3500/05-01-02-01 3500 series front card and rear card
133292-01 Mechanical vibration monitoring system
3500/25 149369-01 Bently State Monitoring Interface System
3500/32 125712-01 Mechanical vibration monitoring system
3500/15E BENTLY TSI system module
3500-42M Bently State Monitoring Interface System
